Used ASM Eagle 60 #9173706 for sale

ASM Eagle 60 is a high-precision flip chip bonder for precision microelectronic applications. It has a modern compact design with comprehensive features including a thermal sub-equipment with Z-axis control, multi-axis robotics for motion control, process automation, and vision system. Eagle 60 bonder is ideal for applications such as flip-chip bonding, such as FIROs, PBGAs, and PLCCs, as well as other electronic assembly applications. ASM Eagle 60 is suited for the highest accuracy applications and offers an advanced integrated thermal control unit with up to 50 individually controllable thermal modules and up to 200 programmable heat setpoints. It also contains a programmable vision machine capable of full 3D component recognition and placement accuracy to 1 micron. Eagle 60 can work with various packages, including QFNs, DFNs, BGA, LGAs, and connectors. It can also bond lead frames, discrete components, and other printed circuitry, as well as wave soldering components and substrates. The bonder features an X-Y platform with 400mm movement range and Z-axis with 200mm of traveling height. It is also equipped with automated probe station for testing and inspecting of electrical parameters, temperature, current, voltage, resistance, etc. For additional process control and monitoring, the bonding process of ASM Eagle 60 can be adjusted using the on-board Autocontrol software. Autocontrol software enables full integration of the machine with the production line, including the ability to detect, limit, or prevent errors during the material or bonding process. Its intuitive graphical user interface , featuring online real-time monitoring of the production processes and alarms, enable a fast start of production without the need for additional training. Eagle 60 is also equipped with laser-guided component feeder systems, automated vision alignment, and monitoring for inconsistent material or operational conditions. In summary, ASM Eagle 60 is an advanced and essential flip chip bonder for precision microelectronics which offers leading performance in terms of bond strength, chip placement accuracy, thermal uniformity, and environmental control. It is ideal for a wide variety of applications, including flip-chip bonding of common audio, automotive, consumer electronic, and other manufacturing applications.