Used ASM Eagle 60 #9213197 for sale

ASM Eagle 60 is a precision bonder intended for the microelectronics industry. It is used in the manufacture of semiconductors, MEMs, and other complex micron-scale products. This compact, cost-effective bonder is designed for both manual and machine operations. Eagle 60 features a low thermal expansion CuBe base which helps to provide fine micro alignment accuracy and long-term performance. The large and rigid frame construction provides maximum stability and minimizes vibration. The work area dimensions are 120mm x 80mm x 80mm, providing a large working area for multiple substrates. ASM Eagle 60 is powered by a Windows-based bonding engine for mobility and ease of operation. It offers a full range of process parameters for both manual and leaded or bottom terminate programs. The bonder's Joystick positioner and XYZ axes provide precise accurate micro positioning. The machine automatically adjusts each parameter during an initiate process prior to all material joins. Eagle 60 has a top tilt motion ideal for surface mount assemblies. The bonder includes a heated head and process monitor for maximum precision. It also features a heated membrane board and tray which supports up to 8 bonds. An integrated needle and wire threader eliminates the need for a winding station. The bonder's optional built-in monitor allows the user to view up to eight parameters on an LCD display for easy monitoring. ASM Eagle 60 is fast and rugged, providing reliable performance and a long production life. Its compact size makes it easy to integrate into process lines. The cost-effective bonder is suitable for a wide range of microelectronics assemblies and helps to streamline production lines. Eagle 60 is the ideal choice for high demand production, with its user-friendly interface and intuitive process setup.