Used ASM Eagle 60 #9214053 for sale

ASM Eagle 60 is a fully automated consecutive thermal compression bonder manufactured by ASM. This equipment is designed to meet the demanding requirements of high volume, high accuracy die bonding applications. It is capable of all-in-one parallel processes like die attach, wire bonding, and die coating. This equipment offers a wide range of features and capabilities that make it the ideal tool for high volume medical, automotive, and semiconductor die bonding. Eagle 60 features a system controller with a real-time operating unit and is equipped with two independent, fully programmable thermal compression bonders. The machine is highly configurable and can accommodate up to twelve variable-height bonding heads, enabling users to easily change the bonding heads and bond a wide range of dies. The controller's intuitive software provides possibilities for programming complex application-specific operations in either manual or automated modes. ASM Eagle 60 features a five-point vision tool which allows for precise die placement and wire bond verification. The asset also incorporates several safety and monitoring features such as a built-in electrical interlock circuit for any potential technician safety issues, a residue-detection mechanism to prevent potential solder-related defects, and emergency stop buttons. Eagle 60 utilizes a proprietary, light-curing die coating for repeatable die attach operations over wide temperature ranges. Hot gas temperature control combined with advanced cooling technology ensure optimized thermal management and minimized thermal cycling-induced stress. Additionally, the model features a fully shielded laser enclosure to protect the operator from any laser-generated radiation. ASM Eagle 60 is capable of a wide range of bonding operations with different materials and configurations that can be easily adjusted to meet a wide range of applications. With its refined and reliable technology, Eagle 60 provides excellent bonding quality, accuracy, and repeatability. As a result, this equipment is a great choice for any high-volume, precision-critical die bonding applications.