Used ASM Eagle 60 #9220361 for sale

ASM Eagle 60 is a versatile and easy-to-use automated die attach bonder. Designed for the high-volume production of semiconductor packages, Eagle 60 offers superior precision and reliability. ASM Eagle 60 is equipped with independent and variable temperature control systems which utilize parallel heat waveforms and parametric thermal profiling. This thermal technology provides excellent control and flexibility while performing thermocompression and thermocompression capillary bonding. This thermal technology also enables the bonder to provide uniform temperature profiles over a range of component sizes. Eagle 60 has an automated bond force adjustment equipment that has a resolution of 10μm and a extended range of 2.5N, enabling accurate and consistent bond parameters across the entire assembly process. ASM Eagle 60 has a vision system which is capable of object recognition and bond detection. This unit uses image recognition and analysis to provide accurate inspection and verification of bonding results. Eagle 60 is capable of handling a wide variety of components, including lead frame, chip-on-board, chip-on-flex, pre-attached die, and optical tests. It supports a wide range of both adhesive and non-adhesive bonding techniques, providing flexibility and cost savings. ASM Eagle 60 features a suction cup feeder machine that is easy to use and adjustable to accommodate any component size, providing a more secure and reliable attachment of components to the die attach surface. Eagle 60 also has a cleaning tool that can be used to clean components prior to bonding in order to enhance bonding performance and reliability. The cleaning process can be completed by either ultrasonic or solvent cleaning. ASM Eagle 60's fast cycle time of 750-800 parts per hour ensures an efficient production line. Additionally, the bundle capacity of up to six parts into one carrier means fewer carriers in the production line, leading to cost savings. Eagle 60 is one of the most advanced bonders on the market and offers superior performance and flexibility of component handling. Its features provide the user with greater control and precision, allowing for quality end products.