Used ASM Eagle 60 #9238877 for sale

ASM Eagle 60 is an automated wire and die bonder designed for precision die and wire attachment. It is an innovative and reliable solution for a wide range of applications, such as assembly of optoelectronic devices and hybrid microcircuits. Eagle 60 offers outstanding repeatability and accuracy in the attachment of die and wire to substrates with both thermosonic and ultrasonic bonding methods. ASM Eagle 60 has an integrated controller along with real-time dynamic control of bond parameters. It has a wide range of options, including standard to advanced configurations, the ability to create custom processes, and a variety of tools for attachment, electrical testing, and vision inspection. There is an integrated dual bond head option for 2 heads to work in parallel, reducing the cycle time. Eagle 60 is also equipped with an automated vision system, providing the ability to read a bar code, verify the silicone serialization, and inspect the wire attachment to ensure accuracy. ASM Eagle 60 comes with an easy-to-use user interface, offering the capability to configure, sequence, and store process recipes. It can be easily integrated into a factory automation system, allowing advanced control and traceability. Eagle 60's ergonomic design combined with its high-quality servo motors and linear guide rods ensure smooth and quiet operation. It also provides reliable and consistent operation with minimal downtime. ASM Eagle 60 can bond gold, gold alloy, copper, and aluminum wire with a diameter ranging from 0.2mm to 1.6mm. It has an XY resolution of 0.1µm, an angular resolution of 0.01°, and a vertical accuracy of +/- 7.5µm. This bonder has a maximum displacement range of 150mm and a programmable bond height of 5 um. Eagle 60 has a 7 day week scheduler and can handle up to 5 jobs in single production mode. ASM Eagle 60 is designed to be reliable and efficient with high flexibility to accommodate a wide range of applications. With its precise die and wire attachment, Eagle 60 is the perfect solution for optoelectronic devices and hybrid microcircuits.