Used ASM Eagle 60 #9249871 for sale

ASM Eagle 60 is a high-precision, high-performance, desktop precision bonder specifically designed for gold ball and size bonding of semiconductor components. This machine is capable of assembling and testing many different types of semiconductor components, including die attach parts, lead frames, ball grid arrays, and ball-grid-array (BGA) chips. Eagle 60 precision bonder is highly versatile and is capable of quickly and accurately processing a wide variety of micro and macro assemblies. The Eagle can be accessed and configured for various production and test applications with its easy-to-follow graphical user interface (GUI). This machine is highly accurate and controls its processes through customizable, step-by-step recipe entry. ASM Eagle 60 can accurately position the die attach components to within 0.15mm with its precision automated motion control equipment. To ensure a flat surface for bonding, the Eagle can also optical profile the die attachment surface and adjust the die attach force accordingly, allowing for uniform and consistent bonding and attachment. This machine also includes an inert environment that allows for safely processing heat and humidity-sensitive components. Eagle 60 is equipped with a high performance laser system that can weld components with gold ball bond wires that are as small as 0.75mm in diameter. The Eagle's laser unit can both monitor and automatically adjust for feedback or input from the micro-vision machine, ensuring the most accurate bonds are made every time. Also included on the Eagle is a vision tool and a high resolution microscope that work together to accurately examine and measure the bond wires during operation. The Eagle also provides a powerful data logging asset that allows operators to keep track of process parameters, production data, and results. This model is capable of displaying high resolution graphs, real-time trends, and process charts to help operators quickly analyze their data and troubleshoot any issues that may arise in the production or test environment. ASM Eagle 60 is the ideal machine for semiconductor component assembly and testing, offering unprecedented accuracy, versatility, and reliability. With the Eagle, users can quickly and accurately bond and package efficient solutions for their customers' needs.