Used ASM Eagle 60 #9286323 for sale

ASM Eagle 60 is a precision angle and wedge bonder for semiconductor die and component assembly. It is designed to deliver superior performance and provide excellent process control. The bonder features an adjustable robotic arm that can precisely control the position of the die and component, providing superior accuracy and repeatability. Eagle 60 features a learning mode and has built-in algorithms to allow the user to create custom bond profiles, with control over bond parameters such as bond strength, pattern, heating time, and force. It also has a standard 5 megapixel digital camera with an image processing library, allowing for automatic die angle and wedge detection and positioning. The bonder is equipped with a high-precision strain TCE Peltier-heating system, which allows precise temperature control and heat transfer. ASM Eagle 60 can perform a variety of bonding operations such as wedge, copper, gold, and aluminum bonding. The adjustable tray allows for easy placement of various sizes of components. Eagle 60 also features a high-precision servo control system with superior positioning accuracy, reducing bonding time. The aluminum frame construction provides better air exchange efficiency and superior thermal insulation. The user-friendly interface and automatic control system, with a full range of safety features, makes ASM Eagle 60 a reliable and versatile bonder for efficient production. This bonder is suitable for use in production lines that require high accuracy and repeatability, making it ideal for IC packaging and assembly of electronic and optical components.