Used ASM Eagle 60 #9299358 for sale

ASM Eagle 60 is an advanced electronic die bonder designed for handling medium to large surface area parts. This machine has a modular design with a dual drive equipment that enables the platform to move in both the X and Y directions. Eagle 60 is manufactured by the Swiss firm ASM and is based on the company's proven Eagle platform. This bonder is compatible with various materials, such as polyimide, copper, LCDs, and LEDs. ASM Eagle 60 has the capability of bonding all of these materials to surfaces through a thermal or ultrasonic process. Eagle 60 features two individually driven stages with an embedded vision system giving the machine more than 6 axes of motion. This vision unit uses an array of linear and rotary sensors to detect the size, orientation, and precise placement of the parts. The result is uniform and repeatable bonding with flexibility to compensate for process errors. In addition, ASM Eagle 60 can be programed to bond multiple parts or deposits in the same cycle. Eagle 60 is powered by a computer-controlled operating machine, which is integrated with a graphical user interface (GUI). The GUI provides menus for setting parameters such as speed, force, temperature, and duration. This makes programming the bonder for specific jobs/products easy and fast. The built-in vision tool also gives the machine the ability to locate and inspect for defects in parts which are located at different positions on the work surface. ASM Eagle 60 has a bonding force range of 24-100N and a temperature range from 0-120°C. Its advanced motor drives allow the platform to accelerate quickly. It can handle transported substrates up to 150mm x 600mm. Additionally, the high modularity of Eagle 60 makes it suited for a variety of assembly processes, ranging from automated optoelectronic assembly to optoelectronic packaging. In addition, ASM Eagle 60 is EN 61326 Class B compliant and has an Alf 14 UL-certified software package available. Overall, Eagle 60 is a precision bonder that offers flexibility for multiple assembly processes. Its modular design, dual drive asset, and integrated vision model make it an excellent choice for medium to large sized applications.