Used ASM Eagle 60 #9364785 for sale

ASM Eagle 60 is a high precision, vision-assisted equipment for automated die and wire bonding. It is designed to meet a wide variety of bonding challenges, including complex applications that require precise placement and looping of microsized wires. The system comprises three components: a platform, a die bonding head, and a wire bonding head. The platform consists of an X-Y axis motorized gantry that moves the components in the bonder's X and Y directions. The motorized gantry is driven by a belt unit that ensures smooth motion and helps reduce vibration during bond placement. The machine also features a Z-axis slide, which helps to precisely control the tool height, as well as a linear encoder, which provides precise positioning and ensures repeatable accurate placement accuracy. The die bonding head is capable of placing traditional die, MEMs die, and CSP die. It is equipped with an on-the-fly die placement tool that allows Eagle 60 to bond die in as little as 10 milliseconds. The asset also features a 12-megapixel digital camera with vision assisted die placement accuracy of +/- 10 µm. The die placement accuracy is further enhanced by the incorporation of an advanced image processing algorithm. The wire bonding head is used for the looping and bonding of fine and ultra-fine wires. It features multiple bond heads with independent programmable settings that allow for the optimal placement of the wires. The wire bonder is equipped with advanced control systems and algorithms that can help to reduce wire looping time and optimize looping uniformity. In addition to these features, ASM Eagle 60 also includes a host of safety and reliability features. These include a vibration and gravity sensing monitoring model that helps to reduce the risk of vibration-induced wire breakage, as well as an off-center wire detection and alignment equipment that offers accurate wire placement and efficient looping. and bonding operations. Overall, Eagle 60 is a highly reliable and efficient hybrid wire bonding and die placement system that offers a high degree of accuracy and repeatability. This unit is suitable for both low and high-volume wire bonding and die placement production requirements and can be used in a wide range of applications.