Used ASM Eagle 60 #9395227 for sale

ASM Eagle 60 is a fully automated, thermosonic, ribbon wedge bonder that provides efficient and reliable operability for all types of bonding applications. With a maximum bonding force of 60 grams and a bonding temperature adjustment range of 50-400 degrees Celsius, Eagle 60 is designed for applications in the medical, automotive, aerospace, data storage and consumer electronics industries. ASM Eagle 60 features a robust design that ensures precise and reliable thermosonic bonding results. The simple and intuitive design of the bonding platform also makes operation of the machinery unintimidating and user-friendly. Eagle 60's adjustable, heated worktable also allows users to achieve optimal heating for their thermocompression and thermal compression processes. ASM Eagle 60 utilizes an ergonomic work-surface and offers superior high resolution sensing capabilities measuring up to 0.1 micron. This high-level of precision makes Eagle 60 an ideal choice for intricate and delicate wiring and small pitch connections. In addition, the bonder's thermal control unit allows operators to fine-tune parameters for wire bonding tasks within a broad temperature range. ASM Eagle 60 is designed to provide consistent performance and quality results and incorporates an intelligent vision system for tracking and guiding material bonds. This system also allows users to store references for similar procedures and determine if the current bonds meet desired standards. Eagle 60 also features a fully automated feeder system that eliminates the need for manual ratcheting and provides precise control over ribbon management. The bonder also features several different substrates guides, allowing operators to easily find settings for each specific material being bonded. In conclusion, ASM Eagle 60 is a feature-rich and user-friendly bonder that is designed for a wide range of requirements. With its reliable construction, multi-function capability and superior accuracy, Eagle 60 is a great choice for any application requiring thermosonic or thermal compression bonding.