Used ASM Eagle 60 #9396301 for sale

Manufacturer
ASM
Model
Eagle 60
ID: 9396301
Wire bonder.
ASM Eagle 60 is a bonder designed for precision thermal and ultrasonic micro-assembly of components. It features a highly intuitive user interface and offers fast, precise, and reliable micro-assembly. With its innovative design and engineering, Eagle 60 can provide accurate dimensions and repeatable performance. The bonder comprises of several components, each performing a specific function. It is equipped with an intuitive three-step user interface to guide users through setup and manual operation. The base unit consists of the X-Y platform which enables precise substrate motion and alignment. Above the X-Y platform is the Vision System comprised of a camera and illumination module, which is used for viewing the assembly process. The bonder's main unit features advanced heaters and controllers which precisely and reliably manage the thermal parameters of the process. Additionally, the bonder includes a phase adjustment module which enables acoustic scanning and bonding of components. In terms of performance, ASM Eagle 60 offers a maximum bonder height of up to 0.5 mm and a maximum bonder temperature of up to 320°C. It also features a reliable cylindrical frequency generator for fine-tuning frequency parameters, oscillation range and a wide temperature range to provide optimal adhesion and strength of the bond. Eagle 60 is a cost-effective bonder which boasts an impressive range of features that help to ensure consistent, reliable, and accurate micro-assembly. Additionally, the bonder is capable of connecting to an external process control system, allowing for greater control and precision, as well as enabling the automation of processes. ASM Eagle 60 also offers advanced connectivity options to ensure flexibility and integration with other devices in the production chain. It is designed to meet the highest safety and quality standards to offer a dependable and cost-effective solution to any micro-assembly process. The result is comprehensive, cost-effective thermal bonding with exceptional accuracy.
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