Used ASM Eagle 60 #9396302 for sale

ASM Eagle 60 is a fully automated wafer bonder designed to provide highly accurate and reliable bonding of wafer levels and multi-level structured components. This equipment uses a combination of pressure and heat to secure components of the assembly together. It utilizes a patented 6-axis positioning mechanism that allows the user to accurately and efficiently position wafer level components and control the BondTool speed. Eagle 60 features a 12 zone thermal chuck design which ensures a uniform heat treatment over the entire wafer surface. This enables the bonding of large area wafers. ASM Eagle 60 is equipped with a high precision laser sensor that can measure the average heights of up to 28 points on a single wafer. This allows the accurate positioning of wafer level components and provides a stable bonding environment within a 5 micron height tolerance. Its fully automated design helps minimize the labor required for positioning and bonding of components, increasing the productivity of the overall process. Additionally, this system is equipped with a built-in self-diagnostic unit for controlling and monitoring hardware status. Eagle 60 also offers a range of options to customize the machine. For example, it can come with either the BonderHead2 or the BonderHead3. Both of these optional heads are designed to accurately bond different types of components such as Au-bonded, Cu-bonded, and other lead-free components. Additionally, it comes with a variety of other optional components such as a Microscope Monitor, which helps the user easily view bonding-in-process. In conclusion, ASM Eagle 60 is an advanced wafer bonder that provides a high level of accuracy and reliability. Its built-in features such as the 6-axis positioning mechanism, 12-zone thermal chuck, and integrated laser-measuring tool make this asset ideal for high volume production. Furthermore, its customizable features enable the user to tailor the model to their specific application needs.