Used ASM Eagle 60 #9396305 for sale

ASM Eagle 60 is an automated wafer bonder designed to provide precision and repeatable results. It utilizes advanced technology to precisely align and connect semiconductor wafers to create a single monolithic structure. Eagle 60 features an XYZ gimbaled stage to provide flexibility in wafer spacing and alignment. Its motion equipment provides linear, circular, and scan motion settings to achieve desired accuracy and bond parameters. The system also has the ability to detect wafer warpage and automatically correct for it. Motion is controlled by ASM Eagle 60's Eddyvector® motion controller, allowing the unit to accurately move the wafer stage and achieve precise alignment with each bond cycle. Eagle 60 includes an advanced vision machine which is capable of capturing images of the wafers to ensure a properly calibrated, repeatable alignment. The vision tool also includes a high-resolution camera, wide-field optics, and auto-focus functionality. This enables ASM Eagle 60 to identify and recognize wafer patterning which is vital for proper alignment and bonding performance. Eagle 60 has the ability to easily load wafers into the bonder at its main loading station. It can accommodate wafers up to 300mm in diameter, and can bond wafers with a thickness up to 1.5mm. The asset offers several bond process types including chip to chip, die to die, die to wafer, and wafer to wafer. It also offers a wide range of bond methods, including TAB bonding, non-contact sapphire bonding, and high current bonding. ASM Eagle 60 also has intuitive software which allows for easy customization and setting of the bonding parameters. In addition to this, it includes cycle data logging and statistical process controls (SPC) for monitoring of the model's output. This assists in assuring that the bonder is performing as expected and that bonding is meeting the criteria of the specifications each time the equipment reaches an assembly cycle. All of these features work together to provide users with a reliable and accurate bonding solution.