Used ASM Eagle 60 #9396313 for sale

ASM Eagle 60 is a low-force precision die bonder and offers industry-leading bond accuracy, speed, and flexibility. It is one of the latest additions to ASM portfolio of advanced die bonding and testing equipment. Eagle 60 is designed for placement of semiconductor dies up to 60mm x 60mm onto PC boards, substrates, and other surfaces. Its outstanding accuracy and stability ensure superior first-time-yields and improved productivity, allowing users to achieve extremely low defect rates in a single pass. It employs an advanced optical alignment equipment with powerful telecentric zoom optics that provide a clear image of the die bonding process. This system is used to determine the exact coordinates of the die with extreme precision. Once pinpoint accuracy is achieved, ASM Eagle 60 then utilizes a state-of-the-art pressure-controlled bonding head to bond the die. This unit infinitely adjusts the pressure output and ensures that precise tension is applied throughout the bond cycle. Eagle 60 also offers a variety of bonding techniques including eutectic bonding, thermocompression bonding, thermosonic bonding, fast & soft bonding, force-controlled bonding, and air jet soldering, all with the ability to program custom application-specific recipes. ASM Eagle 60 is capable of performing multiple other processes such as reballing and wire bonding. This allows users to perform multiple high-end processes using the same board. An intuitive and user-friendly software package is provided with Eagle 60 also allows for easy integration into a production environment. ASM Eagle 60 is an all-in-one machine that offers great flexibility and superior die bond accuracy. Its extremely precise alignment tool, pressure-controlled bonding head, and varied capabilities make it an ideal choice for high-precision die bonding applications on both advanced and legacy substrates.