Used ASM Eagle 60 #9396314 for sale

ASM Eagle 60 is a state-of-the-art die bonding equipment that is designed to deliver unsurpassed bonding accuracy and repeatability for all types of die attach processes. This system is engineered to meet the highest quality standards and is ideal for a wide range of assembly tasks, such as chip die bonding, ceramic die attach, flip chip and wafer level packaging. Eagle 60 achieves unprecedented levels of precision by utilizing its linear force control technology and advanced wafer-level package processing capabilities. This unit has a 9-axis motion unit that provides greater accuracy and faster cycle times. Its dexterity arm can move at speeds of up to 3 meters per second. ASM Eagle 60 can effectively manage and accurately place multi-die components with accuracy, speed and agility. In addition, Eagle 60 has an integrated process control machine which helps ensure the highest quality and repeatability across multiple components. The tool also includes a self-correcting auto-calibration feature that ensures accurate die and substrate placement. This prevents a risk of the die falling out and causing loss of components. ASM Eagle 60 also features integrated visual process control and an intuitive graphical user interface that makes it easy to set up, operate and maintain the asset. It can also interface with a range of peripheral systems, such as a production line scanner or monitor, to provide real-time production performance feedback. Eagle 60 is an adaptable model as it features a variety of integrated options and tooling that allows the user to tailor the equipment to meet changing production needs. It can handle different bonding materials, has flexible tooling options for manipulating the die and substrate, and can be set up with up to two feeders for parallel production runs. ASM Eagle 60 is designed to give users the highest level of precision, repeatability and quality assurance for their production needs. With its powerful performance, intuitive operation and ultimate process control, this system is the ideal choice for any die attach task.