Used ASM Eagle 60 #9402551 for sale

ASM Eagle 60 is a state-of-the-art bonder designed to meet the rigorous demands of the advanced semiconductor and microelectronic packaging industry. It is a fully automated equipment that enables simultaneous wire bonding, die attach and component placement. The system is capable of producing high-quality bonds with uniform wire diameters and lengths over a wide area. The bonder is built on the company's latest Unit Management Architecture (SMA) platform, which ensures consistent process results and machine uptime. Eagle 60 is available in two models: the Standard model and the Efficient model. The Standard model offers three-axis motion capability and a soft-release mechanism for reduced component force during wire bonding. The Efficient model offers five-axis motion capability, soft-release, and automatic component cut-off, allowing for faster throughput and fewer manual interventions. Both models offer a wide bonding window and will bond wires up to 0.25 mm in diameter. ASM Eagle 60's highly-accurate die attach station can align and attach components with great precision, and an in-situ wire sweep machine guarantees a clean bonded area. Eagle 60 features industry-leading advanced features such as an integrated process automation engine, user-friendly touch screen interface, and camcorder-assisted placement and inspection. All parameters are stored in the "Move Assistant" wizard, making set-up easy and consistent. The tool is easy to maintain as well; it comes with a maintenance module that can be accessed by the user, which allows for direct real-time diagnostics of asset failures and problems. ASM Eagle 60 is ISO 9001 and OSHAS 18001 certified and is designed to meet demanding quality standards. In addition to its wide range of features, it is an incredibly reliable and efficient model that can provide the highest levels of process accuracy, repeatability, quality, and speed. In conclusion, Eagle 60 is an ideal bonder and die attach equipment for any advanced microelectronics packaging needs.