Used ASM Eagle 60AP #293668035 for sale

ASM Eagle 60AP is a precision bonder designed for processing of flip chip and chip-scale packages as well as fine pitch and fine pitch geometries, offering a maximum die pitch as small as 0.3mm. It features four independent dispense needles and two floating optical alignment cameras which allow for precise component placement. ASM EAGLE 60 AP is capable of processing components with standard IPC specs, making it suitable for a variety of applications such as memory and CPU chip mounting for automotive and consumer electronics. The equipment can be operated in manual or automatic modes and includes a high resolution digital display for convenient display of the necessary functions. The equipment also provides automatic choice of the appropriate dispense needle and provides data storage for up to 500 different projects, which can be copied or spread from one project to another. For better control, the system is equipped with two stroke sensors that enable increased pattern accuracy and reduces eye fatigue. It also has an independent temperature controller that can be used to optimize the heating process. Eagle 60AP has several safety features, including a panic button that stops operation in case of emergency. There is also a light coipler to ensure proper communications and a shutoff valve to block any inadvertent pressure. The unit also has a forced self-test that checks the integrity of all the machine parameters prior to processing. EAGLE 60 AP is a user friendly, high-performance bonder that is perfect for a wide range of applications. With its automatic operator for both manual and automatic modes, it is able to function in a variety of configurations making it ideal for any production floor. Furthermore, its safety features and reliable components ensure that the tool is an excellent choice for all bonding applications.