Used ASM Eagle 60AP #293670675 for sale

ASM Eagle 60AP is a high-precision, automated bonder designed for use in industrial microelectronics production. It is utilized for a wide variety of applications, including wire-bonding and die-bonding microcomponents using both thermocompression and thermosonic techniques. ASM EAGLE 60 AP features a flexible precision process control equipment that provides precise control over temperature, force, time, and material selection. This enables it to produce extremely reliable and repeatable bonds with minimal waste. Eagle 60AP features a computer-controlled automatic module that can be used to monitor and control all aspects of the bonding process. This module incorporates an advanced vision system that allows the user to monitor the progress of the bonding process from any angle. This unit is also used to detect any defects before the bonding process and can be utilized to prevent any quality issues related to the bond. EAGLE 60 AP was designed for use in high-volume industrial electronics production and utilizes a two-station approach for production. This allows for increased process throughput and minimal downtime. The two-station design also allows for rapid tool changeovers, allowing for efficient production of large quantities of parts. ASM Eagle 60AP has multiple process control settings which can be adjusted according to the requirements of the application at hand. The bonding process can be set to either thermocompression or thermosonic bonding, depending on the material requirements of the application. It also has a current and force calibration machine which ensures the highest quality bonds every time. ASM EAGLE 60 AP has a durable construction, with an integrated cooling tool and a robust design that allows it to work in hostile industrial environments. This makes it ideal for use in production lines, assembly plants, and other high-demand manufacturing environments. It is also backed by ASM own customer service and support team, making it a reliable and cost-effective solution for industrial microelectronics production.