Used ASM Eagle 60AP #293671386 for sale

ASM Eagle 60AP is an advanced, automated bonder, equipped with a wide range of integrated features designed to make it the perfect choice for most semiconductor assembly applications. ASM EAGLE 60 AP features a highly advanced array of imaging capabilities that enable it to accurately and quickly locate and inspect bond wire and lead locations. Its advanced vision system provides 3D image stitching and a wide field of view, allowing it to accurately detect the placement of wires, leads, and components. Eagle 60AP is designed for speed and accuracy when bonding. Its onboard robotic arm is equipped with a high-precision XYZ measuring system, enabling it to accurately position and handle components, wire and lead connections, and impedance matching in record time. It also features a high-speed, picture-in-picture bond sensing and control, creating a real time 360-degree view of each bond to ensure precision. EAGLE 60 AP also offers high quality thermal control, allowing it to maintain clean and consistently accurate temperatures while bonding. Its adjustable flux control enables it to precisely control the amount of flux required for each bond. Additionally, it has an intuitive interface that allows for process parameter adjustment with the click of a button. In addition, ASM Eagle 60AP boasts a number of advanced safety features. Its integrated safeguards prevent heat damage when connecting and attaching components, and its quick-release top cover and a keyed door allow it to be used safely and securely with operator authentication. ASM EAGLE 60 AP is an all-in-one solution that is capable of meeting virtually any semiconductor assembly application. Its powerful features, intuitive interfaces and reliable performance make it the ideal solution for any industrial or consumer product assembly.