Used ASM Eagle 60AP #293751116 for sale

ASM Eagle 60AP is a fully automated wafer, chip, and die bonder designed for high accuracy, high throughput, high quality production. With its compact-footprint design and flexible bond head configurations, it offers a cost-effective solution for advanced packaging and device assembly. ASM EAGLE 60 AP is ideal for many applications including package-on-package and flip chip construction, die-to-die, die-to-substrate and hybrid bonding. Eagle 60AP is equipped with advanced features to ensure accuracy and repeatability of bond processes. The equipment is equipped with both a non-contact vision system and a digitally-controlled bond head scanner that allows for fine-tuned adjustments to be made for each application. Laser height sensing is used to detect and correct for height variations, to ensure that the bond is made with the highest level of accuracy relative to the substrate's surface. EAGLE 60 AP has a highly adjustable die picker to accommodate different sizes and shapes of die. It is capable of simultaneously placing two or more dies accurately with micron-level stability. It is also designed to provide temperature control for the die and substrate, which is critical for high-temperature processes such as Flip Chip and Eutectic Bonding. To improve setup and changeover times, ASM Eagle 60AP is equipped with a pneumatic bond head tip exchange unit. This allows for quick, clean and repeatable tip exchange. It also aids in the prevention of contaminants from entering the bond chamber during operation, in addition to reducing the number of tool changes that are required. ASM EAGLE 60 AP is constructed with a reliable construction of materials suitable for high throughput processes. It has a rigid frame and cooling elements composed of aluminum and stainless steel to enhance thermal energy transfer. The control machine on Eagle 60AP is fully programmable for an easy transition from process development to series production. It also includes an adapter allowing for fast process recipe adaptation and operations over a secure connection with the remote server. EAGLE 60 AP is a powerful, reliable and cost-effective die bonder specifically designed for high-volume manufacturing. Its advanced features and compact design provide a solution for die bonding processes with the utmost productivity and quality.