Used ASM Eagle 60AP #9080124 for sale

ASM Eagle 60AP is a multipurpose, automated, precision wire bonder, developed by ASM for optimal performance in the production of reliable and robust microelectronic components. It supports the latest technology and utilizes feature-rich and innovative algorithms, allowing it to execute complex bonding operations with minimal intervention from an operator. ASM EAGLE 60 AP also delivers superior wiring speed and quality, controlling loop formation parameters to ensure consistent connections and reduce machine setup time while producing low loop heights, single aluminum, episodic copper or gold ribbon wire bonds. Eagle 60AP offers a user-friendly user interface with customizable settings to meet various component production requirements. It features intuitive and informative screens which allow operators to quickly be familiarized with the machine functions. EAGLE 60 AP allows operators to choose from a wide variety of bonding techniques,including thermocompression, ultrasonic, thermosonic or convection. Additionally, it is designed with a single station turbine drive that allows for rapid wire feeding and looping. Moreover, it can bond various wire diameters across a variety of package sizes with an optimized control algorithm, which can be fine-tuned for speed and accuracy. ASM Eagle 60AP offers several additional features, such as a detailed data logging system, giving the user the ability to track and record all aspects of the bonding process in real-time. Furthermore, ASM EAGLE 60 AP can quickly and accurately de-stitch wire assembly and achieve an excellent degree of accuracy when axially and radially aligning components. It also features computer-controlled vision systems for automated optical inspection, which helps reduce defects and ensure quality control. Furthermore, Eagle 60AP is designed with a fiber attachment system for performing wire-to-fiber connections. This system allows for the clean and efficient application of bond and fiber wire and provides a reliable connection that is highly resistant to oxidation. In conclusion, EAGLE 60 AP is a feature-rich, automated bonder offering superior performance and reliability in the connection of microelectronics components. It provides a wide range of bonding capabilities and offers excellent quality control, making it an invaluable asset in the production of reliable and robust microelectronic components.