Used ASM Eagle 60AP #9124543 for sale

ASM Eagle 60AP is a top-of-the-line precision automated bonder manufactured by ASM Pacific Technology Inc. This device offers the highest level of accuracy and repeatability in bonding operations, allowing for the production of complex product bonds with low thermal process cycles and low error rates. ASM EAGLE 60 AP offers a comprehensive bonder line with a wide variety of options and capabilities. Eagle 60AP utilizes advanced thermal and high-resolution vision systems to analyze and dispense precise amounts of customizable conductive adhesives, ensuring a strong and reliable bond. An optional pull test is available to verify bond strength, ensuring consistent results within tolerance. EAGLE 60 AP also features intuitive programming and advanced process monitor systems to reduce processing time. Operators are given full control over the bonder's settings, allowing for the customization of temperature, dispense pressure and volume with minimal effort. A variety of components including flat and fine-pitched substrates, microelectronic packages, and LED panels can be bonded using a wide range of UV and heat-curable die attach adhesives, eliminating the need for costly bridging. In addition, ASM Eagle 60AP has an integrated heating feature which allows for the rapid curing of parts within a specified temperature range. ASM EAGLE 60 AP is designed for easy operation. It features a large LCD display which displays real-time diagnostics, system feedback information, and manual step action regarding the bonding operation. Eagle 60AP also comes with an automated setup function that creates the desired bond profile for each product automatically, eliminating operator errors. Furthermore, EAGLE 60 AP has an intuitive graphical user interface which allows operators to easily monitor the bond parameters in real-time, increasing cycle times and reducing overall costs. All in all, ASM Eagle 60AP is a highly sophisticated automated bonder that offers unmatched precision and accuracy when bonding components. It is an ideal solution for industries that require high-resolution vision systems, low thermal process cycles, and low error rates in their bonding operations.