Used ASM Eagle 60AP #9135845 for sale

ASM Eagle 60AP is an automated, state-of-the-art bonder specifically designed to meet the needs of production-oriented electronic assembly. This advanced bonder is reliable, accurate, and efficient, offering precise thermal control and high-speed transfer of thermodynamic cycles to the workpiece. ASM EAGLE 60 AP features a fully automated system capable of accurate and repeatable bonding cycles. The bonder operates with an electronically controlled linear actuator, driven by a precise servo motor, to precisely position the bonding tip over the workpiece surface. Its hardened stainless steel bonds are precision-polished to produce a precise and reliable attachment with minimal contact force. Eagle 60AP has an automatic work stage indexer and a large LCD display that provides easy-to-read information about the status and settings of the bonder. In addition, the indexer is equipped with an adjustable fingertip control and the power to quickly and precisely reach the desired nine-point positions when switching between tasks. This feature allows users to quickly and accurately set the bonder for different operations. EAGLE 60 AP features a high-speed, non-contact thermoprobe that provides fast and accurate temperature control. The thermoprobe utilizes a temperature-dependent resistive element to securely adjust the temperature of the bonding tip according to the requirements of the task. ASM Eagle 60AP bonder also features an advanced thermocouple control, which can be set to monitor the temperature of the bonded material. This control ensures that the cycle parameters are accurately set for each and every bonding task. The powerful bonder also features a microprocessor-controlled Master Control Unit, which can be programmed to automatically detect and compensate for environmental factors such as vibration and temperature. The Master Control Unit is also used to limit power to the bonder to protect it from power surges and other environmental threats. ASM EAGLE 60 AP bonder is suitable for a variety of electronics assembly tasks, including: wire bonding, semiconductor packaging/assembly, thermal film attach, insulation pre-form attach, and flex circuit assembly/attach. This advanced bonder has been designed to provide maximum accuracy, reliability, and speed, while minimizing cycle times and improving throughput.