Used ASM Eagle 60AP #9191807 for sale

ASM Eagle 60AP is a precision bonder designed for high throughput and advanced reliability in semiconductor, optoelectronic, MEMS, and medical device applications. This automated precision bonder is capable of meeting higher throughput requirements in a single bonder than most conventional systems. ASM EAGLE 60 AP offers an advanced temperature control equipment with a wide temperature range and precise low-temperature control. In addition, Eagle 60AP makes use of a number of advanced features to facilitate a wide variety of applications. This includes an autocalibration system that automatically compensates for tool and environment changes. A built-in SmartProfile™ DAQ unit further enhances the bonder's automation capabilities and shortens the learning curve time by allowing users to easily assign multiple profiles to the same wafer type. This bonder also features an auto-positional alignment machine which ensures precision optimization with the focus on reducing scrap and optimizing yield. EAGLE 60 AP also contains a patented air jet tool designed to minimize the thickness of the bond. This results in higher quality finished products. ASM Eagle 60AP also features a wide range of tools for high quality and multi-material bonding requirements. This includes two standard bond interfaces, two concentric bond task heads, two flat tip and three stepped tip bond heads, among many other configurations. ASM EAGLE 60 AP also comes with an intuitive touch screen GUI and a support package that provides remote access to ASM Engineering when needed. This bonder is backed up by ASM world-class service and support team. As such, Eagle 60AP is a reliable and cost-effective bonder that allows for efficient and precise production bonding without compromising on quality.