Used ASM Eagle 60AP #9217447 for sale

ASM Eagle 60AP is a semi-automatic flip chip bonder designed for the high-speed production of flip chip semiconductor packages. It is capable of bonding chips with up to 600 μm pitch between die and substrate to ensure a strong mechanical connection and reliable electrical performance. The machine operates through a combination of vacuum, heat and pressure to bond the chip. The EV300 flip chip bonder automatically aligns die to substrate and eliminates manual alignment. Utilizing a heated precision surface mount (SMT) tool, it applies parallel pressures to ensure a strong and reliable mechanical bond. The flip chip bonder also features improved bond quality for low-frequency and high-speed operations as well as improved die attachment with reduced potential cracks. ASM EAGLE 60 AP's precision height control mechanism and advanced vision module enable flip chip assembly accuracy for low-height packages and high pitch spacerless flip chip applications. The vision module also helps identify misalignments and adjust ball placement measurement for the die assembly. Additionally, the bonder can be programmed to accommodate various size dies. Eagle 60AP is designed for high-volume production and has a low-cycle times of 10.5 seconds. The machine has a footprint of 115.8 cm x 125.7 cm and weighs 338.6 kilograms. The bonder has a vacuum drive motor, pressure drive motor and a high-performance inter-connection main board. It also has electrical components such as a power supply, motor control board and main control board, and utilizes an industrial computer including a touch screen graphic monitor. The machine is certified to meet CE safety standards. The total cost of EAGLE 60 AP is approximately $85,000. It is a reliable and cost-efficient solution for high-volume production of chip packages and provides maximum productivity, accuracy, and bonding flexibility. It is the ideal choice for the ever-evolving micro-electronic technology industry.