Used ASM Eagle 60AP #9220360 for sale

ASM Eagle 60AP is a high-performance medium to high-volume automated flip chip and wire bonding equipment. It is specifically designed for small and mid-size high-volume production lines as well as Research and Development applications. ASM EAGLE 60 AP features four bond head modules; wedge-style bond head, gold wire bonder, gold wedge-style bond head and copper wire bonder. The bond head is capable of performing 4-4, 4-1, 4-6, and 4-5 bonding processes. It offers a versatile bonding capability for the production of a variety of flip chip, wire bonding, and optical fiber applications. The process steps are integrated into an expandable architecture that allows users to add additional components when needed. To ensure the highest level of bonding performance and reliability Eagle 60AP is equipped with a microprocessor-based bonding controller. This controller provides real-time monitoring, troubleshooting and diagnostics of the bonding process. It provides precise control of process parameters, temperature, pressure, and force profiles for accurate process results. EAGLE 60 AP also features a user-friendly, touch screen executable software interface. This software allows users to easily access and modify the controller settings for a variety of different process types. The user-friendly interface makes setup, calibration and troubleshooting of the bonding system easy and stress-free. ASM Eagle 60AP comes with a 4-power supply unit to control temperature, current, voltage, and force values. This machine provides accurate control of each parameter during the bonding process. This makes the tool suitable for a variety of high-volume production and R&D applications. In addition to the features mentioned above, ASM EAGLE 60 AP also offers a robust design for easy maintenance and repair. The unit is equipped with on-board diagnostics and maintenance logging to ensure timely service and repairs. The asset also features shock and vibration environmental protection to ensure reliable operation in production environments. All together, Eagle 60AP provides a reliable, cost-effective, and user-friendly solution for high-volume production and Research and Development applications. It offers high-performance, accuracy and repeatability for the production of a variety of high-performance and high-end flip chip and wire bonding applications.