Used ASM Eagle 60AP #9260913 for sale

ASM Eagle 60AP is a fully automated precision and controlled-temperature bonder designed for the assembly of semiconductor dies on substrates, microelectronic packages, MEMS packaging, and other components. ASM EAGLE 60 AP is an advanced system ideal for production and development applications. Eagle 60AP provides precise alignment and placement capabilities by utilizing high resolution displacement sensors, video-assisted vision systems, and precision motor-driven motion. The system can be configured to recognize and react to substrate, die, and bonder placement specific to the application at hand. Through the combination of these technologies, EAGLE 60 AP produces repeatable results with extremely high yields. ASM Eagle 60AP has a large working envelope, making it capable of accommodating wafers with up to nine inch diameters and is equipped with a dual-die-aligner mechanism that ensures accurate die placement. The bonder offers automatic tool selection and programmability, allowing for high-level of production flexibility. The program can be easily stored and retrieved for quick setup and changes. ASM EAGLE 60 AP offers a powerful automated bonding process that can bond multiple die wiring methods with cross-hatching, daisy chain, column/pin, fan/tree, and one-to-one wires from 1-150µm in diameter. This system is built on a precise, temperature-controlled platform that provides uniform temperature regardless of the environment. A two-stage temperature controller is employed that finely controls temperature with a total variation of ±0.5-degree Celsius over the range of 50-400 degrees Celsius. Eagle 60AP is capable of carrying out a number of different advanced processes depending on user requirements. These include gold-copper or solder bumping, a variety of epoxies, such as flip-chip, eutectic, and alloy adhesive bonding, thermocompression bonding, and even flip-chip assembly processes. EAGLE 60 AP is designed for high-speed assembly, fast cycle-time, and low-maintenance costs. Economical and reliable, ASM Eagle 60AP makes semiconductor assembly faster, more accurate, and more cost effective. It is the perfect tool for applications that require high precision assembly of semiconductor dies onto substrates.