Used ASM Eagle 60AP #9266830 for sale

ASM Eagle 60AP bonder is a computer-controlled programmable wire bonder composed of a CCD microscope, handling platform, Z-axis, and control system. It is designed for low to medium volume production of advanced semiconductor, MEMS, micro assemblies, and optoelectronic packaging applications. ASM EAGLE 60 AP bonder is capable of looping a wide variety of wires and attaching devices to customers' host materials using both ball and wedge bonding technologies. It features an efficient vision system, superior accuracy, and faster bond times. The unit is able to automatically detect various types of wire and perform quality checks with its integrated on-board camera. The high-performance Z-axis helps the bonder to accurately move the wire to the location to be bonded. Eagle 60AP also features a Windows-based software that allows easy programming and operation. The software uses a detailed graphical display to show tooling and device setup parameters, bond loop parameters, and real time feedback from the machine's sensors. This also allows users to add their own custom settings and monitor the process online. EAGLE 60 AP includes various machine protection functions and safety protocols to ensure the machines are properly maintained and secure. These safety features help to prevent bonder breakdowns and maintain excellent working conditions. ASM Eagle 60AP is designed to meet the most demanding requirements of high-volume production environments. It is reliable and efficient, offering excellent productivity, minimal downtime, and consistent high quality bonds. The high-performance machine is also easy to maintain and expensive time consuming manual rework is reduced significantly.