Used ASM Eagle 60AP #9268593 for sale
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ASM Eagle 60AP is a superior bonding station designed for repeatable, precision thermal metallization for a wide range of die-attach and wire bonding applications. This all-in-one equipment boasts a compact design and outstanding dexterity, making it perfect for a wide range of production and research and development applications. ASM EAGLE 60 AP offers a variety of tools for a variety of die-attach and wire bonding tasks. The heated metallization station on Eagle 60AP produces superior results for long-term bond integrity. This powerful device utilizes an efficient dual mode design, which allows operators to power up to an 8kW heating device that can handle any production environments. Additionally, EAGLE 60 AP features a miller motor with a maximum 200N force range that guarantees optimized adhesion and seals securely. ASM Eagle 60AP also features a powerful computer system and a convenient fully-automated mode, which allows users to take full advantage of the onboard software. The unit allows users to access over 1,000 recipes and program 15 individual bond programs. It also allows for full control of the machine through a comprehensive user interface, and is capable of easily reproducing faithfully executed parameters when programming. ASM EAGLE 60 AP further offers a reliable X/Y tool for die-attach applications, and a die-attach head control tool with a spring probe and a 5-axis precision motion asset for reliable positioning. The 5-axis model is capable of moving the head in 0.008 mm increments for precise bonding placement. Finally, Eagle 60AP comes loaded with all the necessary safety features, including protection against ESD, over voltage, over current and other power irregularities. EAGLE 60 AP is an efficient and reliable bonder, perfectly designed for die-attach and wire bonding applications. Its advanced design eliminates time-consuming setup and provides superior results. With all of its features, ASM Eagle 60AP is sure to provide maximum performance in all production and research and development environments.
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