Used ASM Eagle 60AP #9286321 for sale

ASM Eagle 60AP is a fully automated, high-performance, multi-function die bonder. It is suitable for a wide range of applications, from large-scale to small-scale manufacturing. ASM EAGLE 60 AP is equipped with a high-end displacement platform, allowing it to traverse an impressive 24x19 mm range for routine alignment and die placement. This bonder is capable of performing a wide range of bonding tasks, including flip chip, TAB, and wire bonding. Eagle 60AP can be controlled remotely, and its programmable software and firmware can be adapted to accommodate new and unique requirements. EAGLE 60 AP features a CCD camera and advanced optical alignment equipment for precise placement. This bonder is designed to increase accuracy and control while decreasing cycle times, and it is capable of handling components as small as 1mm2. It utilizes a high-speed, non-contact transducer that seals bonds, ensuring secure and precise contact between components. ASM Eagle 60AP's dedicated power supplies and movable thermocouples provide precise control of temperatures and enable repeatable processing temperatures. ASM EAGLE 60 AP is constructed with a stainless steel vacuum chamber and a multiple-axis motion system that allows high precision and repeatability. It is designed to provide a safe working environment for the operator, and it offers easy maintenance and adjustment for routine maintenance. Its simple setup and operational control panels enable users to quickly and easily operate and monitor the inspection unit. Eagle 60AP is designed to increase production up time and decrease costs. It features a built-in testing machine for diagnostics and operating conditions, with production data automatically stored in the tool for future reference. Its monitoring capabilities allow users to check process conditions in real time. In conclusion, EAGLE 60 AP is a versatile, high-performance bonder with multiple features for increased accuracy and efficiency. It's optimal for use in a even wide range of applications, offering precise and reliable bonding, testing, and monitoring capabilities.