Used ASM Eagle 60AP #9286351 for sale

ASM Eagle 60AP is a fully automatic automated bonding equipment designed for the high precision attaching and handling of flip chips to substrates or film frames. This system enables the automatic application of low melting point materials such as solder, wire bonds, solid or molten phase bonding agents, epoxies, and thermally activated adhesives. ASM EAGLE 60 AP is equipped with superprecise X-Y motion stages, enabling it to bond small parts and achieve high accuracy. Furthermore, it provides an optional high resolution modular rapid processor (HRMP) vision unit which permits a wide range of automated inspection functions. Eagle 60AP is fitted with a range of versatile, modular bonding tools, including multiple electrode bonds, spot welders, ultrasonic transducers, dispensers, and die bonders. Its power supplies and thermocouples are designed for controlling various heating levels, including low temperature, medium temperature, and high-temperature applications. Additionally, EAGLE 60 AP also comes with a built-in cooling machine to ensure efficient operation and reduce heat-sensitive component damage. ASM Eagle 60AP is also equipped with efficient image process and pattern recognition functions, allowing for precise determination of the alignment, size, shape, and orientation of the bonding parts. Furthermore, it is modularly expandable, meaning that various process modules can be added or upgraded for specific application upgrades. Its touchscreen LCD control interface offers a user-friendly and intuitive control for easy operation and navigation. Despite its high-precision bonding capacity, the Eagle AP60 features a robust design and energy efficient operation that ensures a long useful life. It also features a conformal coating of its internal components, making it highly resistant to dust and debris. Furthermore, it has a built-in safety interlock safety feature and emergency shutoff to protect against operator injury. Overall, ASM EAGLE 60 AP is an ideal solution for precision bonding requirements in a wide range of industries and applications. Its high accuracy and durability makes it a reliable choice for automated bonders. Its intuitive interface, modular construction, and safety features make it easy to use and maintain.