Used ASM Eagle 60AP #9299066 for sale

ASM Eagle 60AP is a high performance, medium to large scale automated precision wire bonder designed for today's advanced and specialized semiconductor packaging needs. ASM EAGLE 60 AP bonder features bond force monitoring, enhanced accuracy and repeatability, and a host of features that increase productivity and can reduce production costs. Eagle 60AP is equipped with micro-pressure monitor technology to ensure precise mechanical force control. This helps to ensure that all wire bonds achieve the desired mechanical strength and reliability. EAGLE 60 AP also offers a wide range of bond techniques suitable for a broad array of packaged devices and is capable of soldering, reflowing, thermocompression, and ultrasonic bonding techniques. ASM Eagle 60AP provides a variety of rapid bond motion profiles, allowing for faster bonding cycles and efficient overall bond speeds of up to 520/sec. In addition, ASM EAGLE 60 AP offers advanced wire data and tracing capabilities, along with production statistics to help identify and address potential production problems. Eagle 60AP provides additional capabilities with an automated wire feeder system, encompassing a suite of features such as spooling, dual-wire accommodation, wire storage, and wire loading profiles. The wire feeder system helps to reduce idle time, thus helping to increase production throughput. EAGLE 60 AP also offers an easy to use Windows based XP interface, combined with a bright graphical TV monitor for easy operator viewing and control. This control panel offers complete control of all system functions, including bond statistics, set up, and troubleshooting. In conclusion, the lightweight, reliable and user-friendly, ASM Eagle 60AP is an excellent choice for medium to large scale automated precision wire bonding applications. With a wide range of bond techniques and advanced motion profiles, ASM EAGLE 60 AP is capable of meeting the needs of today's most advanced and specialized semiconductor packages.