Used ASM Eagle 60AP #9395001 for sale

ASM Eagle 60AP is an advanced automated bonder designed for high-volume production of chips, packages, and wafers. It is capable of executing a wide range of different bonding techniques, including flip-chip, ball-shaped, wedge, and wire bonding. ASM EAGLE 60 AP can bond both fine pitch and ultra-fine pitch packages with precision. It utilizes a number of advanced proprietary technologies, such as patented multiple stage wafer flip-chip bonding techniques, die-to-die dynamic motion control for extremely accurate alignment, and an advanced tilt stage equipment to accurately engage wire bonding process steps. Eagle 60AP's control system enables quick selection and adjustment of bonding parameters, facilitating fast changeovers and increased throughput. It also allows programs to be stored, recalled, and modified for multiple product categories. With its robust, swing-field high power and high accuracy optical head, the unit offers very accurate pitch over packages with tight geometries and added features for package thickness compensations. EAGLE 60 AP is equipped with a temperature control unit that ensures ultra-low-temperature delivers on bonding heads, along with an adjustable flow path that is ideal for bonding underfills, as well as other processes. ASM Eagle 60AP's easy-to-use, highly intuitive touchscreen interface allows for manual entry, support for multiple languages, and full traceability of each process step. The machine also offers customizable footprints and can be equipped with various automatic or planned event alarm systems, enabling the user to adjust the tool to their specific needs. For added flexibility and safety, ASM EAGLE 60 AP is enclosed within a static-safe enclosure. This ensures that static build-up does not cause any inadvertent damage to components that could occur from an unprotected environment. The asset has several additional safety features such as pressure monitors, dual-phase fail-stop systems, and an EMI-shielded environment that protects components from electro-magnetic fields. Offering high precision and reliable performance, Eagle 60AP is the ideal choice for companies that require a sophisticated automated bonder. It is capable of high-volume production with fast changeovers and is suitable for a variety of bonder applications.