Used ASM Eagle 60XL #9302482 for sale

ASM Eagle 60XL is a focused ion beam (FIB) bonding tool that is used for precise and reliable wafer-level bonding. Eagle 60XL is designed for a wide range of metal bonding applications, including copper and aluminum alloys, as well as a variety of semiconductor, optoelectronic, and optomechanical devices. This FIB tool consists of four primary components: a high-vacuum chamber, a gas injection system, a charged-particle beam column, and a debonding/fusing platform. The vacuum chamber provides an environment that is free from air and gas molecules, and the charged-particle beam column allows the focused ion beam to target the wafers and bond them together. The gas injection system adds the necessary inert gas to the environment to control the energy and speed of the beam, while the debonding/fusing platform allows for the metal or semiconductor materials to be melted and joined together. ASM Eagle 60XL offers the user a range of bonding options with a precision of up to 1 nanometer. It also provides a wide range of temperature, pressure, and gas options to optimize the process. The debonding/fusing platform is designed to provide a uniform temperature profile, along with precise control of the temperature, pressure and duration of the process. In addition to bonding metals, Eagle 60XL provides a range of other features and functions such as in-situ process monitoring, target-oriented control, automated thermal cycling, and yield monitoring. The in-situ process monitoring allows for exact control over the bond parameters, while the target-oriented control allows the user to preset and verify multiple process parameters. ASM Eagle 60XL also offers the ability to perform automated thermal cycling, which is used to validate process reliability. Eagle 60XL contains automated thermal fusing that allows for proven throughput and performance, while its automated yield monitoring capability ensures that bonds are of the highest quality. Overall, ASM Eagle 60XL is an advanced, high-precision FIB bonding tool perfect for those needing reliable and precise wafer-level bonding. It offers a full range of metal bonding, as well as a variety of additional features and functions. The combination of high precision, automation, process monitoring, thermal cycling, and yield monitoring make Eagle 60XL an ideal choice for reliable metal or semiconductor bonding.