Used ASM Eagle Aero Gocu #293595200 for sale

ASM Eagle Aero Gocu is a precision bonder designed to provide quick and precise bonding applications for a variety of electronics components, from wire-bonded, multi-layer substrates (MLS) to all types of wide-area communications components, including ball-grid array (BGA), chip-scale packages (CSP), and W-L-CSP. The bonder's compact, compact frame, allows it to fit into even the tightest of spaces, enabling it to perform a variety of precise bonding and soldering operations in a variety of settings, including microelectronics manufacturing, aerospace, automotive, and others. Eagle Aero Gocu offers precise control and accuracy, allowing it to bond components as small as 0.001 inch pitch with minimal effort and precise results. The bonder's patented dual vision imaging technology captures and combines both images from a microscope and LED-based vision aiding in precise laser-bonding and camera-based soldering operations. To ensure precise alignment, it also employs ultrahigh-divided-alignment technology that automatically detects the exact positioning of all components in bonding and soldering operations with accuracy of less than 0.001 micron. ASM Eagle Aero Gocu is equipped with a high-power laser station and built-in LN2 chiller that enable higher performance than standard bonders, as well as prolonging the longevity of each tool. These two features also help to reduce cycle time and error rate of each operation, helping to reduce overwork and shorten the time needed to complete each job. Eagle Aero Gocu also features fully-automated, programmable bonder and soldering operations, enabling a variety of component processing and bonding. To ensure top-notch bond placement, the Aero Gocu employs adaptive algorithm technology that continually analyzes each component and adjusts the operational pattern accordingly. This enables bonders to complete components accurately and quickly, allowing them to cover more projects and reduce both error rate and turnaround time. ASM Eagle Aero Gocu is an advanced bonder that offers precision-controlled operations to reduce cycle time and minimize errors. It is designed to meet the needs of a variety of electronics component assembly tasks, from wire-bonding, printing and soldering to mounting, potting and encapsulating of components. Letting users to bond with precision, without compromising speed or quality, Eagle Aero Gocu is the ideal solution for demanding electronic manufacturing applications.