Used ASM Eagle Aero Gocu #293629265 for sale

Manufacturer
ASM
Model
Eagle Aero Gocu
ID: 293629265
Wire bonder.
ASM Eagle Aero Gocu is a high-performance bonder designed for advanced applications in the aerospace, military, marine, and medical industries. It is designed for high-precision applications such as lamination and bonding processes. Eagle Aero Gocu features a precision automated operation equipment with a level of accuracy that allows high standard deviations from the desired bond temperatures. The system includes a special digital thermocouple control unit and can be calibrated to the bond situation, including variations in pressure, temperature, and humidity. This bonder also features high-performance output of up to 9KW of power and is ideal for a wide range of materials. ASM Eagle Aero Gocu is built with an optimized thermocycling machine with a digitally controlled digital servouController. This ensures better accuracy and repeatability in temperature settings. The tool is also equipped with a special overload/underload protection setting. This settings detects any thermal overload or underload and could turn off the device to save energy and prevent damage to the machine components. Eagle Aero Gocu also features a powerful touch screen that allows easy control and monitoring of settings. This user friendly asset has streamlined whole bonding processes and greatly reduce operator intervention in the work process. Through the interactive screen, operators can easily program the machine for specific bonding processes and monitor all parameters. ASM Eagle Aero Gocu is a highly advanced & efficient bonder that provides continuity to aerospace, military, marine, and medical industries with reliable bonding processes. It has an integrated high-pressure model that makes sure that temperature and pressure settings are exactly according to desired results. The equipment also has several safety features that help protect against electrical shock, unusual heat, mechanical failures, and other accidents connected with a heat conductive bond process.
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