Used ASM Eagle XP #293645257 for sale

ASM Eagle XP is a manual thermocompression die bonder for assembling semiconductor devices and components. This bonder is designed for high-precision bonding of lead-frame and chip scale packages, as well as discrete components in a variety of markets, including automotive, LED, and medical. ASM EAGLE-XP is a high-performance bonder that offers precise control and repeatability of the soldering process. Featuring a precise and fast bonding process, accurate metering of temperature and speed settings, and CCD camera alignment, Eagle XP ensures precise die placement and bond formation. Furthermore, customizable bonding patterns make this bonder suitable for a wide range of production needs. EAGLE-XP's advanced controller allows the user to quickly and easily achieve precise bonding conditions. From settings of temperature and speed, to control of dispense force and traverse speed, ASM Eagle XP provides a full range of highly precise settings for the assembly process. A CCD camera allows immediate vision-adjustment of the bonder, while an adjustable spot size feature ensures the specified size spot is created on the bond head. The robust construction of ASM EAGLE-XP makes it suitable for a wide variety of settings. Its unique frame design resists vibration and deformation, ensuring precise bonding every time. Additionally, Eagle XP is highly automated, providing multiple programmable steps for fast and repeatable processes. An intuitive user interface provides simple, user-friendly operation of the bonder, and quick access to documentation, recipes, and settings integration. Overall, EAGLE-XP is a reliable and powerful bonder for the assembly of semiconductor devices and components. Its precise and accurate control settings and automated processes allow the user to quickly and easily achieve high-precision bonding. Its robust construction and user-friendly interface make it suitable for a wide range of settings, ensuring quality and repeatability of the bonding results.