Used ASM Eagle XP8 #9293648 for sale

ASM Eagle XP8 is a fully automated semiconductor wafer bonder designed to provide reliable and accurate results in the high tech semiconductor industry. Eagle XP8 enables users to combine and bond semiconductor wafers and eutectic materials quickly and precisely, and it is flexible enough to bond materials of any size. ASM Eagle XP8 offers a very efficient and precise bonding process. It enables the creation of accurate, strong adhesion layers with tight thermal control. With its advanced control systems, it helps ensure consistent thermal profiles within each process. Eagle XP8 features a tightly sealed bond chamber, ensuring that no external contamination can enter the bond chamber, and it ensures a uniform temperature throughout the process. ASM Eagle XP8 uses high precision aligners for placement of wafers and materials. This ensures that the bond is accurately aligned and can then move to the heating stage. Eagle XP8 also features a built-in passivation system that shields the bond from harmful radiation and prevents any potential damage to the delicate components. ASM Eagle XP8 is a very robust machine, and it can bond materials of any size and shape. With its wide range of adapters, clamping devices and adaptable grippers, it can bond a variety of material combinations quickly and easily. Eagle XP8 is also compatible with automated processes and can be integrated into full production lines. ASM Eagle XP8 is designed to work with a variety of wafer types, including low-thermal-mass wafers. It offers a wide range of process parameters, allowing users to tailor the process to their needs precisely. Eagle XP8 also features high levels of repeatability, meaning it can produce consistent results time and time again. For added safety, ASM Eagle XP8 features an inert gas system which helps prevent explosions and other accidents. In addition, it is designed with multiple safety protocols and self-diagnostics that ensure consistent, safe operation. Eagle XP8 provides users with the perfect solution for their bonding needs, allowing them to quickly and accurately bond materials and wafers of any size, reliably and precisely. By enabling a more efficient and accurate production process, ASM Eagle XP8 ultimately lowers cost and increases yields.