Used ASM Eagle Xpress Gocu #293669548 for sale

ASM Eagle Xpress Gocu is a high-performance, floor-mounted bonder that is designed to address the needs of fast, efficient and reliable die, wedge and button bonding applications. The Gocu offers a host of impressive features, including stepper motor drives, optical encoders, infrared and ultrasonic bonding technology, and comprehensive bond force control. Eagle Xpress Gocu's rigid frame construction provides stable and durable performance over extended periods, and its stable drive systems allow for precise control of the bonder's motion. The Gocu also includes a pneumatic bond force adjuster that can be adjusted from 0-9.5 tons and a precision optical encoder for exact speed and positioning control. The Gocu also includes an integrated high power ultrasonic bonding equipment with an adjustable power output and frequency, allowing for precise control and repeatability. The Gocu's automated vision system ensures accurate placement of parts prior to bonding. An LED ring light and a high-resolution camera provide ideal lighting conditions and viewing angles for the analysis of wires, chips, and other details required for successful bonding. Additionally, the Gocu's integrated vision unit allows for the implementation of various automated programs and processes. The Gocu provides several enhanced safety features, such as force and torque feedback to alert the operator of unsafe conditions, and a lockout feature for shutting down the machine without losing essential settings. It also includes an internal diagnostic machine for easy service and maintenance, and comprehensive data logging capabilities for easily monitoring and analyzing systems performance. ASM Eagle Xpress Gocu is an advanced, yet versatile and easy to use bonder, offering flexibility, precision, and reliability for quick and reliable process results. With its durable construction, advanced vision tool, and automated safety features, the Gocu provides a dependable and efficient solution for wire and die bonding applications.