Used ASM Eagle Xtreme Gocu #9252502 for sale

ASM Eagle Xtreme Gocu bonder is a fully automated wafer bonder machine designed specifically for bonding semiconductor wafers of various sizes. The equipment uses integrated advanced bonding techniques such as Very High Frequency (VHF) inductive bonding, High Pressure Inductive Bonding (HPIB), and Noble Resistance Bonding (NRB). It supports various bond geometries including stud bump, Microbumps, and flip chip bonding. ASM EAGLE XTREME GOCU bonder features a robust, touch-screen user interface, auto-rewind electrode system that can accommodate a variety of wafer sizes, 6-axis robotic arm for precise alignment, integrated high-speed vision unit for accurate placement of electrodes, and advanced process controlling software. The machine also allows for precision temperature control of up to 600 degrees Celsius and offers an optical microscope designed for high magnification needs. The machine is equipped with four automatic load locks and convenient, fast unloading without film oxygen contamination. It is capable of bonding wafer-level CSP, wire bonds, and pad/loop bonds. It has a fast reset time, advanced bond monitoring features, and an adjustable chamber pressure setting. Eagle Xtreme Gocu bonder provides numerous benefits over manual wafer bonding. It has a much more precise placement for electrodes, control of the wafer temperature throughout the entire bonding process, higher throughput, better repeatability of results, and a decrease in the amount of time it takes to bond a wafer. Overall, EAGLE XTREME GOCU bonder is a great choice for those needing a highly reliable, automated wafer bonding machine. It provides excellent bonding capabilities and control and can be used in a wide range of manufacturing applications.