Used ASM Eagle Xtreme Gocu #9292084 for sale
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ID: 9292084
Vintage: 2014
Wire bonder
Minimum compressed air: 4 Bar
Power supply: 220 VAC, 1500 W, 50/60 Hz, 7 A, 2 Wire + ground, single phase
2014 vintage.
ASM Eagle Xtreme Gocu is a powerful bonder that is designed for the most demanding application requirements. This bonder is perfect for high-performance and ultra-precision applications. ASM EAGLE XTREME GOCU is an advanced, high-end bonder with advanced thermal and mechanical parameters for ultra-fast bonding, fast reflow soldering, and medium-large wafer bonding. Eagle Xtreme Gocu is equipped with a high precision mechanical stage, allowing for precise placement and bonding of components on the substrate surface. It also has high stability and reproducibility in the parameters of its operation, providing an even thermal and mechanical platform. The bonder can be used to bond a wide range of materials, including metal foils, metal ribbons, ceramic materials, and other substrates such as glass and plastic. The bonder is equipped with an advanced thermal system with a heated stage to ensure the ideal bonding temperature. EAGLE XTREME GOCU also features a patented "thermal wave" technology that ensures uniform heating of the workpiece. This technology allows for significantly faster bonding times with uniform results with no temperature overshoots or thermal damage. ASM Eagle Xtreme Gocu also has a bonding force adjustment feature, allowing for a perfect bond or reflow solder contact. ASM EAGLE XTREME GOCU bonder also includes a unique bonding configuration, which can be programmed and adapted to a variety of application parameters. This feature allows the device to adapt to specific process requirements, giving users unprecedented bonding performance. Eagle Xtreme Gocu also includes a profile memory that stores up to 55 process profiles for up to four different applications. EAGLE XTREME GOCU bonder is an advanced and powerful bonder with advanced and user-friendly features. Its efficient operation and reliable performance make it an ideal choice for any application that requires fast and ultra-precise bonding. The bonder is easy to use and set up and has a wide range of adjustable parameters, providing maximum performance in any application.
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