Used ASM Eagle Xtreme Gocu #9350661 for sale

ASM Eagle Xtreme Gocu
Manufacturer
ASM
Model
Eagle Xtreme Gocu
ID: 9350661
Wire bonders, many available.
ASM Eagle Xtreme Gocu is a high-performance bonder specifically designed to meet the stringent requirements of Extreme Ultraviolent (EUV) semiconductor chip production. The machine uses high-powered laser diodes paired with advanced imaging and positioning systems to create perfect bonder lines between dies stacked in varied chip architectures. The results are extremely precise components that can be integrated into semiconductor chips. ASM EAGLE XTREME GOCU includes dual laser diode banks housed inside a sealed and climate-controlled chamber. Each laser diode can produce a pulses of energy up to 1000 Watts for assembly with a high degree of accuracy. The laser diode beams are focused by a equipment of movable lenses and mirrors to achieve the perfect bond. Eagle Xtreme Gocu also comes with a high-precision vision guide. This vision guide includes advanced imaging technology that can inspect and measure each die before, during, and after bonding. It also contains a depth-sensor, which helps to align components before bonding so that all dies are perfectly aligned, contributing to the high quality of the bonder's results. EAGLE XTREME GOCU's high-precision positioning systems allow for vastly increased accuracy in the construct of parts. This system automatically shifts the position of the laser beam, making tiny adjustments in the beam's path, and in doing so, ensures an extremely precise bond line. ASM Eagle Xtreme Gocu is also equipped with a user-friendly communications unit. Through this machine, customers can communicate with technicians operating the bonder and monitor its performance. Furthermore, the user-friendly programmable logic control software allows the user to customize their bonder for specific application needs. In short, ASM EAGLE XTREME GOCU is an efficient and precise tool for producing high-end semiconductor chips. It offers a wide range of features including precise laser diode banks, advanced imaging and positioning systems, and intuitive communication and programming systems. These features combined make Eagle Xtreme Gocu an excellent Bonder choice for any customer looking for the highest-quality chip results.
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