Used ASM Eagle Xtreme Gocu #9361901 for sale

ASM Eagle Xtreme Gocu is a fully automated bonder designed to provide consistent and reliable performance for a variety of electronic bonding applications. This bonder is equipped with the latest advances in automation, allowing for increased production and higher quality of bonds. The machine includes a high degree of flexibility for different substrate shapes and sizes, as well as a wide range of temperature settings to accommodate various process requirements. The bonder is equipped with a high-end precision vision system, which ensures precise alignment for each bond location. This gives users the confidence that their bond placement will not only look good, but also be accurate. ASM EAGLE XTREME GOCU also features a full range of on-board process control devices, including automated bond measurements and automated wire cutting. Eagle Xtreme Gocu is capable of delivering high-quality gold, copper, and aluminum bonds, with a minimum bond height of .0004 inches, and a maximum bond height of .0018 inches. It is also capable of bonding up to eight wire sizes, ranging from 33 to 24 AWG. With its advanced process control system, this bonder can produce high-quality bonds with minimal thermal defects and oxidation. EAGLE XTREME GOCU provides many advanced process control features that enable users to customize and optimize their bonder operation. The bond oven temperature can be optimized for each bond type to ensure a consistent bond strength and achieve high bond quality. The bonder includes a process controller, which allows users to monitor the process and ensure a consistent outcome. The Gocu also includes a variety of integrated accessories, which further improve the bonder's operability and performance. These include an automated wire-cutter and support for multiple power supplies, to accommodate multiple wire sizes and bond types. ASM Eagle Xtreme Gocu is an advanced bonder that is specifically designed to meet the demand for high-quality, reliable, and automated bonding operations. The combination of high precision vision, process control, and an array of automated features, make this bonder an ideal choice for a wide range of electronics applications.