Used ASM Eagle Xtreme Gocu #9395225 for sale

ASM Eagle Xtreme Gocu is a revolutionary boding equipment that is designed to make microelectronics and medical device production easier and more efficient. The Gocu is capable of bond force and bond current control with an adjustable dwell time setting. This system also provides an advanced die bond capability that allows manufacturers to attach die to lead frames with precise control. ASM EAGLE XTREME GOCU is a hybrid unit combining pneumatic and piezo actuation technologies. The Gocu offers an industry-leading small bondhead size of 0.85mm, providing higher bondability, precision and accuracy. An intuitive, user-friendly interface and intelligent software control make the Gocu easy to use. It features a built-in thermal control machine, allowing users to select the optimal temperature for bonding based on the application. An adjustable stroke control gives users the flexibility to adjust the stroke of the bondhead to accommodate different sizes and types of die. The Gocu has a range of programmable modes, giving users ultimate control over their production process. The Advanced Bond Function Mode (ABF) allows users to easily and precisely adjust the bond time, bond force, current and dwell time. The High Mass Mode (HMM) allows for faster and more precise application of high mass die. The Gocu is designed for manufacturing facilities that need to quickly and accurately connect electrical components to substrates and lead frames. It is perfectly suited for producing and assembling high performance integrated circuits and medical devices. It provides a consistent and reliable bond each time, making it an ideal tool for producing high quality microelectronics. Eagle Xtreme Gocu is optimized for efficient and consistent results. Its robust design ensures reliable and repeatable performance, making it a perfect choice for any production facility looking for accurate bonding in a fast-paced environment. With its precise control and industry-leading features, the Gocu makes it easier to manufacture high performance microelectronics and medical devices.