Used ASM Eagle Xtreme #9254497 for sale

ASM Eagle Xtreme is an advanced automated bonder that enables high throughput joining of dissimilar materials with extreme precision to create microstructures of different geometries. This bonder is specially designed for high-precision aligning and bonding processes under extreme temperature conditions found in the production of advanced microelectronics and microsystems. ASM EAGLE X-TREME bonder features a next-generation bonding chamber that enables precision alignment and stitching of parts even under aggressive temperature and airflow conditions. It utilizes a high-power laser for rapid and precise scanning and alignment of parts, in addition to a wide variety of tools for mechanical assembly. This enables the user to build complex structures with extreme accuracy. The machine incorporates a highly precise, low drift, high synchronous sample transport system for precise control of the material and bond positioning. The machine also features multiple modes of operation, allowing it to be used for both low-temperature and high-temperature bonding. It is also capable of performing rapid prototyping, due to its ability to rapidly bond dissimilar materials in minutes. The surface appearance of the parts is improved through the use of a total of five nozzle options. The machine also offers a range of image recognition techniques, using advanced machine vision and artificial neural networks. This machine vision provides the user with the ability to quickly identify features and objects on the surface of the parts. To ensure repeatability of the production process, Eagle Xtreme includes a multi-axis platform that supports advanced force-sensing techniques. This ensures fast feedback and adjustments are made quickly and accurately. A high level of performance is maintained with the assistance of the closed_ loop control system. Also included is a user-friendly, menu-driven software, allowing for easy programming and operator control. EAGLE X-TREME is a high-precision automated bonder that provides a reliable solution for precision joining of dissimilar materials. It enables high throughput production in a range of extreme temperature conditions and provides the user with a highly accurate, rapid prototyping capability. This bonder is ideal for producing high-precision microstructures and can be used for a variety of applications.