Used ASM Eagle Xtreme #9256620 for sale

ASM Eagle Xtreme is an innovative and versatile bonder that is designed to meet the needs of the modern manufacturing industries. This innovative bonder is able to meet the demands of extreme temperature, high humidity, and extreme pressure without compromising on quality. It is equipped with advanced digital touch screen control panel and incorporates the latest in ultrasound technology to ensure precise and consistent bonding results. ASM EAGLE X-TREME is a compact, lightweight and easy to operate bonder designed for use in the manufacturing and production environment. It has a robust and reliable construction with lamination thickness of up to 6mm and a maximum bonding force of 5kg. The bonder also utilizes a special multi-functional digital display system to provide quick and efficient access to the bonder's controls. This innovative bonder also utilizes advanced bonding technologies such as Pulsed Plasma Arc Bonding (PPB) and Direct Current Sputtering (DCSP). These advanced bonding technologies enable Eagle Xtreme to bond a variety of substrate materials such as metals, plastics, composites, aluminium, stainless steels and super alloys. The bonder also incorporates a fast cooling cycle to provide rapid and precise cooling of the bonded materials. In addition to advanced bonding technologies, EAGLE X-TREME has several features that improve its performance including auto-power switching, dynamic temperature control, real-time temperature monitoring of the bond head, pulse parameters and more. This bonder also includes a range of additional accessories such as a vacuum pump, process heating system and a programmable timer. The timer can be programmed to bond a wide range of materials and bond rates. Overall, ASM Eagle Xtreme is an advanced and highly versatile bonder that is designed to meet the needs of professional and industrial manufacturers. It is a compact and easy to use bonder that incorporates the latest in bonding technologies and includes features such as auto-power switching, dynamic temperature control and real-time temperature monitoring of the bond head. Furthermore, its range of optional accessories make it suitable for all levels of manufacturing processes.