Used ASM Eagle Xtreme #9286301 for sale

ASM Eagle Xtreme is a state-of-the-art bonder designed to provide an uncompromising bond quality in the most challenging bonding applications. It is designed to meet the requirements of microelectronics, opto-electronics, semiconductor and MEMS assemblies. With its advanced feature set and reliable bond quality, ASM EAGLE X-TREME is ideal for ultra-precision flip chip, chip-on-board, chip-on-flex, wafer-level and flip chip packages. Eagle Xtreme features a high-resolution jetting dispenser for accurate and repeatable bond formation. The bonder is equipped with a high-speed piezo jetting platform designed to enable high-throughput die bonding, along with an integrated micro-alignment equipment for exact placement of chip connnectors. The machine is further enhanced with integrated high-precision thermoresistive heating, allowing even higher yields in demanding chip packaging applications. EAGLE X-TREME features a sophisticated wafer-level dispense system for precise die placement, as well as an advanced photon curing unit for high-reliability adhesives. With its high-precision jetting dispenser, the machine can dispense a variety of adhesives, underfills, sealants and conductive ethyl-cyanates, with the highest precision. The machine also features an advanced flexible optical microscopy machine, providing real-time visualization of the die positioning process. ASM Eagle Xtreme has built-in fault diagnostics to ensure the highest quality and reliability of each bond, with the ability to detect invisible micro-defects in the bond formation process. It offers a full line of adhesive curing cycles needed to achieve high-reliability bonding. ASM EAGLE X-TREME is also equipped with a thick-film pasting tool for optimal conductive performance. Eagle Xtreme has been designed for high-reliability bonding in conformance with the most stringent manufacturing standards. Its high-end features combined with advanced algorithms ensure superior quality and uniformity of the components across batches. Additionally, user-friendliness and intuitive controls enhance the user experience and enable productive and efficient operations. EAGLE X-TREME is the perfect solution for all your most demanding bonding applications.