Used ASM Eagle Xtreme #9362735 for sale

ASM Eagle Xtreme is a state-of-the-art bonding equipment designed for the efficient delivery of advanced packaging solutions. Designed with the latest technology, ASM EAGLE X-TREME offers high levels of reliability and performance for a wide range of bonding applications. The system is able to accommodate large substrates and provides precision contact quality, which can be tailored to specific requirements. At its core, Eagle Xtreme is a bonder, which is a device that uses heat and pressure to join components together. The bonder is composed of a main body, controls, sensors, and a thermal head. The mechanical and electrical components are fabricated with precision to ensure stability and accuracy. The main body houses the thermal head and other components, and is constructed with rigid aluminum alloy materials for a solid and reliable performance. To initiate the bonding process, the user sets the desired parameters, such as pressure and temperature, into the control panel. Once initiated, the thermal head heats up, using forced convection from fans within the device. The heated thermal head allows for whatever components the user wishes to bond to be attached and firmly adhered. The unit is designed to be safe and easy to use, and comes equipped with safety features including an emergency power button for emergent shut-off. The machine also features advanced software algorithms for real-time monitoring and control of the bonding process. These algorithms allow for almost-instantaneous feedback on the bonders' performance, and can be used to configure parameters for different parts and products. The software is also updateable, allowing users to stay current with the latest technology. EAGLE X-TREME is also equipped with an integrated vision tool, which is used for high-resolution imaging of the bonded surface. This asset provides detailed information on the bonding quality, and can also be used to detect defects in the bonding process. Overall, ASM Eagle Xtreme is designed to be a reliable and accurate bonder for advanced packaging solutions. The device is capable of providing stable and precise bonds, with great thermal precision and efficient process monitoring. The device is ideal for anyone who needs reliable and robust bonding performance.