Used ASM Harrier #9233708 for sale

ASM Harrier is a fully automated, high precision, semi-conductor bonder designed to deliver reliable bonds and produce high quality microelectronic devices. It has advanced bond head control technology, making it an ideal choice for producing standard components and packages. Harrier is capable of applying precise amounts of epoxy or flux to the bonding surface, and it is equipped with advanced motion control systems that ensure accurate and repeatable device placement on the bond head. The machine's unique design allows for a wide range of wire bonding as well as lamination bonding applications. It also offers a flexible platform that can be quickly reconfigured to accommodate different processes. ASM Harrier has a modular design that includes a main setup featuring an enclosed operating environment with viewing through a series of windows. The equipment is further equipped with an up-front, full-function control panel from which to operate the machine. Its bond head is designed to optimize process stability and eliminate the need for head calibration. Harrier is capable of bonding with a range of bond materials, including wire, epoxy, and die-attach paste. This system has an intermediate level of pin automation that simplifies programming while still facilitating a high degree of control over the process. ASM Harrier also enables a range of advanced bond processes, including ball bump and jet drilling. Furthermore, it is equipped with a camera unit and Illumiprobe™ lighting to monitor the progress of the process. This allows operators to make adjustments before the end of the cycle to maintain high quality bond results. In conclusion, Harrier is a dependable semi-conductor bonder that offers fully automated, precise wires bonding process thanks to its advanced bond head control technology. With its modular design, flexible platform, camera machine, and Illumiprobe™ lighting, it is an ideal choice for producing a wide range of microelectronic devices.