Used ASM Harrier #9314431 for sale

ASM Harrier is an advanced automated bonding equipment designed to enable higher production speed and performance for electronics manufacturing operations. This system provides efficient and accurate electronic production processes in a broad range of applications, such as PCBA, SMT, BGA, and wireless communication networks. Harrier utilizes several unique technologies to offer maximum efficiency and strength during production, combining high-speed conveyor systems with advanced vision and inspection unit capabilities, soldering and/or flip chip placement capabilities, and integrated quality control systems. The conveyor machine is able to accept a wide range of panel sizes and shape configurations, while individually recognizing board size and type. The tool is made up of several different components, including an adjustable height conveyor, supporting frame and control cabinet. The speed of the conveyor asset is adjustable to optimize board throughput. The advanced vision and inspection model is capable of monitoring and detecting defects, ensuring each board is soldered correctly. It can also verify pin placements, reducing factory rejection rates while eliminating the need for manual inspection. The soldering and/or flip chip placement capabilities of ASM Harrier equipment are integrated to provide consistent and repeatable results. These features enable accurate placement of solder joints, with minimal flux spattering and thermal cycle optimization. The force feedback management system and closed-loop servo motor ensure precise pump and stake pressure control, further improving the quality of soldering operations. Harrier unit is also equipped with integrated quality control systems, which can detect and diagnose potential abnormalities using sensors and AI-assisted algorithms. These systems can even predict the outcome of production processes ahead of time, allowing manufacturers to anticipate and manage any potential issues. Overall, ASM Harrier is an advanced automated bonding machine designed to provide high-quality, reliable, and efficient electronic production processes. It offers the right combination of features and technologies to reduce the cost and time required for production, and even anticipate potential errors before they occur.